Перевод слова

Перевод: solder

[существительное]
припой ; спайка ; спаянность ;
[глагол]
паять; спаивать; спаять; запаивать; запаять; припаять

Тезаурус:

1. It seems likely that these were connected not just with aluminium but with copper, lead and zinc stripped from the insides of pipes, solder and fittings by the acid.
2. In antiquity, regardless of the metal being joined, soft solder was generally tin or lead or an alloy of the two.
3. Mercury silvering was certainly practised in the medieval period, but the Romans silvered jewellery, tableware and horse trappings by coating the copper alloy with soft solder (tin and lead), wrapping it with silver foil, then heating until the solder melted and secured the foil.
4. Research by the Water Research Centre in 1981 showed that long runs of copper piping with lead solder could produce high levels of lead in tapwater.
5. There was no surplus solder to spoil the work, but this makes it very difficult to detect.
6. The main difference between the two is the melting point of the solder.
7. The seven chips replace 282 separate components, for instance transistors and resistors, and cut by over 700 the number of solder connections.
8. The very white areas in the cracks are lead solder.
9. Hard solders join by interdiffusion at high temperatures with the metals being bonded, so that composition at the join will be somewhere between that of the solder and that of the object.
10. Soft solder is of course an aid to artefact manufacture as opposed to a raw material for overall construction, and is one of a whole range of alloys with more specialised applications in metalwork.
11. It has to be remembered that the analysis of a soldered joint will not be identical to the composition of the original solder alloy because, unlike adhesives, hard solders bond with other metals by diffusion.
12. Lead was far more important as a metal added to bronze to modify its properties and to alloy with tin to form pewter and soft solder.
13. However, it's easier if you solder the smaller parts first and work upward in size; the smaller parts are much more difficult to keep in the board prior to soldering if the board has to be balanced on larger components.